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  transistors 1 publication date: february 2003 sjc00178ced 2SC5346 silicon npn epitaxial planar type for low-frequency high breakdown voltage amplification complementary to 2sa1982 features ? satisfactory linearity of forward current transfer ratio h fe ? high collector-emitter voltage (base open) v ceo ? small collector output capacitance (common base, input open cir- cuited) c ob absolute maximum ratings t a = 25 c parameter symbol rating unit collector-base voltage (emitter open) v cbo 150 v collector-emitter voltage (base open) v ceo 150 v emitter-base voltage (collector open) v ebo 5v collector current i c 50 ma peak collector current i cp 100 ma collector power dissipation * p c 1w junction temperature t j 150 c storage temperature t stg ? 55 to + 150 c parameter symbol conditions min typ max unit collector-emitter voltage (base open) v ceo i c = 0.1 ma, i b = 0 150 v emitter-base voltage (collector open) v ebo i e = 10 a, i c = 05v collector-base cutoff current (emitter open) i cbo v cb = 100 v, i e = 01 a forward current transfer ratio * h fe v ce = 5 v, i c = 10 ma 130 330 ? collector-emitter saturation voltage v ce(sat) i c = 30 ma, i b = 3 ma 1 v transition frequency f t v cb = 10 v, i e = ? 10 ma, f = 200 mhz 160 mhz collector output capacitance c ob v cb = 10 v, i e = 0, f = 1 mhz 5 pf (common base, input open circuited) noise voltage nv v ce = 10 v, i c = 1 ma, g v = 80 db 150 300 mv r g = 100 k ? , function = flat electrical characteristics t a = 25 c 3 c unit: mm note) 1. measuring methods are based on japanese industrial standard jis c 7030 measuring methods for transistors. 2. * : rank classification rank r s h fe 130 220 185 330 1: emitter 2: collector 3: base mt-2-a1 package 6.9 0.1 2.5 0.1 0.45 1.05 0.05 2.5 0.5 123 2.5 0.5 +0.10 ?0.05 0.45 +0.10 ?0.05 (0.8) (0.5) (1.0) (1.0) 4.5 0.1 14.5 0.5 4.0 0.7 0.65 max. (0.2) note) * : copper plate at the collector is more than 1 cm 2 in area, 1.7 mm in thickness
2SC5346 2 sjc00178ced h fe ? i c c ob ? v cb p c ? t a i c ? v ce v ce(sat) ? i c 0 160 40 120 80 0 1.2 1.0 0.8 0.6 0.4 0.2 copper plate at the collector is more than 1 cm 2 in area, 1.7 mm in thickness collector power dissipation p c ( w ) ambient temperature t a ( c ) 012 48 210 6 0 180 120 90 150 60 30 t a = 25 c i b = 10 ma 9 ma 8 ma 7 ma 6 ma 5 ma 4 ma 3 ma 2 ma 1 ma collector current i c ( ma ) collector-emitter voltage v ce ( v ) 1 10 100 1 000 0.001 0.01 0.1 1 10 i c / i b = 10 t a = 75 c 25 c ? 25 c collector-emitter saturation voltage v ce(sat) ( v ) collector current i c ( ma ) 1 10 100 1 000 0 300 250 200 150 100 50 v ce = 5 v t a = 75 c 25 c ? 25 c forward current transfer ratio h fe collector current i c ( ma ) 1 10 100 0 6 5 4 3 2 1 f = 1 mhz i e = 0 t a = 25 c collector-base voltage v cb ( v ) collector output capacitance (common base, input open circuited) c ob (pf)
request for your special attention and precautions in using the technical information and semiconductors described in this material (1) an export permit needs to be obtained from the competent authorities of the japanese government if any of the products or technologies described in this material and controlled under the "foreign exchange and foreign trade law" is to be exported or taken out of japan. (2) the technical information described in this material is limited to showing representative characteris- tics and applied circuits examples of the products. it neither warrants non-infringement of intellec- tual property right or any other rights owned by our company or a third party, nor grants any license. (3) we are not liable for the infringement of rights owned by a third party arising out of the use of the product or technologies as described in this material. (4) the products described in this material are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instru- ments and household appliances). consult our sales staff in advance for information on the following applications: ? special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. ? any applications other than the standard applications intended. (5) the products and product specifications described in this material are subject to change without notice for modification and/or improvement. at the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date product standards in advance to make sure that the latest specifications satisfy your requirements. (6) when designing your equipment, comply with the guaranteed values, in particular those of maxi- mum rating, the range of operating power supply voltage, and heat radiation characteristics. other- wise, we will not be liable for any defect which may arise later in your equipment. even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (7) when using products for which damp-proof packing is required, observe the conditions (including shelf life and amount of time let standing of unsealed items) agreed upon when specification sheets are individually exchanged. (8) this material may be not reprinted or reproduced whether wholly or partially, without the prior written permission of matsushita electric industrial co., ltd. 2002 jul


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